Before a board powers up, it reveals much about its alignment, precision, and the craftsmanship of its automated assembly. Despite modern SMT processes, even the smallest flaw can lead to major failures later.

What We Do

We examine each PCBA using magnification and structured inspection criteria. This includes checking solder joints, part alignment, lead conditions, flux residue, pad wetting, component height, and any signs of cold solder joints or bridging. We compare our findings to IPC standards and our internal data. When we notice a recurring issue—even one that hasn’t caused a failure—we trace it back to the specific process or machine setting responsible.

Why It Matters

Visual inspection is the first opportunity to spot manufacturing drift. Identifying issues early helps avoid intermittent faults, boosts long-term reliability, and reduces time spent fixing problems during firmware development.