What We Do

Each product unit relies on a carefully assembled and calibrated PCB to operate efficiently. Using a microscope, our quality engineers examine the circuit board during production to catch microscopic issues such as:

• Misaligned surface-mount components

• Cold or cracked solder joints

• Solder bridging or open circuits

• Contaminants like dust or flux residue

This step is done before any firmware upload or enclosure assembly, ensuring only flawless boards move forward.

Why It Matters

Even a tiny solder flaw can cause sensor drift, connectivity drops, or device failure. By identifying these issues under the microscope, we prevent downstream problems so the product performs with the accuracy and reliability it was designed for, right out of the box.

Our microscope-based inspection is one of the ways we uphold that promise. Because to us, invisible issues aren’t acceptable even if you’d never see them, we do.